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Substrate Cleaning Agent - List of Manufacturers, Suppliers, Companies and Products

Substrate Cleaning Agent Product List

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Metal mask printing error substrate cleaning agent VIGON SC 202

Removes cream solder and SMT bond! As it is a water-based cleaning agent, it has no flash point and offers high safety.

VIGON SC 202 is a water-based cleaning agent that reliably removes cream solder and SMT bond in metal mask cleaning. It is also excellent for cleaning printed circuit boards with printing errors. It is recommended for use with spray cleaning machines and ultrasonic cleaning machines. 【Features】 ■ Effectively removes resin, adhesives, inks, solder paste, and flux residues ■ No flash point due to being a water-based cleaning agent, no explosion-proof specifications required ■ Can clean and rinse with a single solution ■ Free of surfactants ■ Contains no halogen compounds *For more details, please refer to the PDF document or feel free to contact us.

  • Chemicals

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Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Why was cleaning considered essential? An explanation of the cleaning needs for no-clean solder and other related topics.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

  • Other cleaning machines

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Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Limitations of existing cleaning methods and challenges in difficult cleaning! An explanation of low standoff cleaning and more.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents

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What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

We will explain the necessity of substrate cleaning, including the latest issues related to ion residues and the effects of metal salts, as well as the analytical methods.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but to ensure high reliability, cleaning has become essential. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information. * You can view the detailed content of the column from the related links. For more information, feel free to contact us.

  • Cleaning agents

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Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.

The joining technology of silver sintering (silver sinter) has been attracting attention in recent years. With the increase in electrical capacity and the utilization of new materials, there is a need for "new joining technologies" that can withstand higher temperatures, higher voltages, and larger currents. The silver sintering process can form a high-density bonding layer through pressing and sintering, resulting in high bonding strength. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

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  • Technical and Reference Books

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Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.

Advanced electronic devices, such as 5G-compatible communication equipment and control units for electric vehicles, are becoming smaller and thinner. Consequently, the development of solder paste for fine bonding is becoming increasingly active. These electronic devices require long-term high reliability, and there is a growing trend for the need for flux cleaning. Due to high-density mounting and the diversification of components, there is an increase in electronic devices with low stand-off. *For more details, please refer to the related links. *The PDF document is a technical resource that explains the cleaning technology required for sintering bonding.

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  • Technical and Reference Books

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Zero defects and half the cleaning time [Improvement case]

About the flux cleaning of high-performance control boards! Introducing cleaning know-how.

In the flux cleaning of high-performance control boards, we adopted an organic solvent-based cleaning agent combined with a jet flow method. While this method was able to clean the exposed surfaces of the boards, it could not completely clean the underside of components with a standoff of less than 20μm, resulting in defects where the required performance was not achieved. This page introduces the method that solved this issue. *For more details, please refer to the related links. *The PDF document is a technical material that explains cleaning technology for advanced electronic components.

  • Cleaning agents

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Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Introducing regulations related to cleaning agents, taking into account efforts overseas!

In recent years, from the perspective of environmental conservation and human protection, countries have been strengthening regulations regarding the handling of chemical substances, and there is a global trend towards initiatives related to the SDGs (Sustainable Development Goals). In Japan, the Industrial Safety and Health Act will be revised in April 2024, strengthening the handling of chemical substances. To reduce health risks for workers and environmental burdens, some companies are moving to avoid procuring materials that have a significant environmental impact, and cleaning agents are no exception. Taking into account initiatives overseas, we will introduce regulations related to cleaning agents. *For detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

  • Cleaning agents

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Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Examples of the analysis of the cleaning properties of surfactants are also included! We will also introduce ions and flux.

This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. We encourage you to download it and read through it. 【Contents】 ■ Introduction ■ What are ionic residues? ■ Analysis of ionic residues remaining on electronic substrates ■ Case study - Cleaning efficacy of surfactants - ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

  • Printed Circuit Board

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Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Trends in flux cleaning due to miniaturization! Introducing technical points in fine bonding products.

Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*

  • Printed Circuit Board

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Cleaning technology required for sintered joint devices [Technical Document]

Introduction to the specific sintering cleaning process! Discussion of the differences from flux cleaning, etc.

This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it. 【Contents】 ■ Introduction ■ The formation of contamination and the effects of residues in sintered joining devices ■ Selection of cleaning agents and methods ■ Cleanliness analysis after cleaning ■ Cleaning case studies ■ Conclusion *For more details, please download the PDF or feel free to contact us.

  • Cleaning agents

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Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

  • Cleaning agents

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What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

  • Cleaning agents

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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

  • Technical and Reference Books

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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

  • Technical and Reference Books

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