Substrate Cleaning Agent - List of Manufacturers, Suppliers, Companies and Products

Metal mask printing error substrate cleaning agent VIGON SC 202

Removes cream solder and SMT bond! As it is a water-based cleaning agent, it has no flash point and offers high safety.

VIGON SC 202 is a water-based cleaning agent that reliably removes cream solder and SMT bond in metal mask cleaning. It is also excellent for cleaning printed circuit boards with printing errors. It is recommended for use with spray cleaning machines and ultrasonic cleaning machines. 【Features】 ■ Effectively removes resin, adhesives, inks, solder paste, and flux residues ■ No flash point due to being a water-based cleaning agent, no explosion-proof specifications required ■ Can clean and rinse with a single solution ■ Free of surfactants ■ Contains no halogen compounds *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Chemicals
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Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Why was cleaning considered essential? An explanation of the cleaning needs for no-clean solder and other related topics.

This document introduces the evolution of solder and cleaning. It explains why cleaning of products is necessary after soldering and discusses the challenges of cleaning no-clean solder. Additionally, it covers the metal composition of solder and the effectiveness of MPC cleaning agents on no-clean solder. We encourage you to read it. 【Contents (partial)】 ■ The trajectory of "solder," a key player in the development of civilization ■ Why was cleaning deemed essential? ■ The metal composition of solder ■ Why does the demand for cleaning no-clean solder arise? ■ Why is cleaning "no-clean solder" difficult? *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Other cleaning machines
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Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

Limitations of existing cleaning methods and challenges in difficult cleaning! An explanation of low standoff cleaning and more.

In this document, we propose our cleaning process as a solution to the increasingly challenging cleaning requirements, using "low stand-off" as an example. In recent times, with technological innovations occurring in various fields, electronics cleaning has progressed to a new stage and is becoming more "challenging." We provide explanations regarding the background and key points of cleaning demand, as well as the importance of cleaning methods, so please take a moment to read through it. 【Contents (partial)】 ■ Introduction – Changes in cleaning demand trends ■ The challenges of cleaning – High performance of products ■ Background and key points of cleaning demand for low stand-off ■ Ensuring wettability and cleaning performance for low stand-off cleaning ■ Benefits of cleaning using MPC *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
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Cleaning agents
Substrate Cleaning Agent

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What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

We will explain the necessity of substrate cleaning, including the latest issues related to ion residues and the effects of metal salts, as well as the analytical methods.

What is substrate cleaning? Is substrate cleaning unnecessary? We provide a detailed explanation of areas where flux cleaning is necessary, among other topics. In Japan, many cases adopt no-clean paste, but to ensure high reliability, cleaning has become essential. We also address the latest cleaning challenges, such as the impact of ionic residues and metal salts on insulation resistance, in this column. Recommended for those who: * Want to investigate the causes of defects despite cleaning * Want to know the latest cleaning challenges and evaluation criteria * Want to explain and promote substrate cleaning within their company, etc. Please see the related links for more information. * You can view the detailed content of the column from the related links. For more information, feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Explaining why cleaning is necessary for sintering bonding! Introducing cleaning know-how.

The joining technology of silver sintering (silver sinter) has been attracting attention in recent years. With the increase in electrical capacity and the utilization of new materials, there is a need for "new joining technologies" that can withstand higher temperatures, higher voltages, and larger currents. The silver sintering process can form a high-density bonding layer through pressing and sintering, resulting in high bonding strength. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

Company：ゼストロンジャパン
Price：Other

Technical and Reference Books
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Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

A fundamental transformation is required for cleaning methods and cleaning agents! Introducing cleaning know-how.

Advanced electronic devices, such as 5G-compatible communication equipment and control units for electric vehicles, are becoming smaller and thinner. Consequently, the development of solder paste for fine bonding is becoming increasingly active. These electronic devices require long-term high reliability, and there is a growing trend for the need for flux cleaning. Due to high-density mounting and the diversification of components, there is an increase in electronic devices with low stand-off. *For more details, please refer to the related links. *The PDF document is a technical resource that explains the cleaning technology required for sintering bonding.

Company：ゼストロンジャパン
Price：Other

Technical and Reference Books
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Zero defects and half the cleaning time [Improvement case]

About the flux cleaning of high-performance control boards! Introducing cleaning know-how.

In the flux cleaning of high-performance control boards, we adopted an organic solvent-based cleaning agent combined with a jet flow method. While this method was able to clean the exposed surfaces of the boards, it could not completely clean the underside of components with a standoff of less than 20μm, resulting in defects where the required performance was not achieved. This page introduces the method that solved this issue. *For more details, please refer to the related links. *The PDF document is a technical material that explains cleaning technology for advanced electronic components.

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Introducing regulations related to cleaning agents, taking into account efforts overseas!

In recent years, from the perspective of environmental conservation and human protection, countries have been strengthening regulations regarding the handling of chemical substances, and there is a global trend towards initiatives related to the SDGs (Sustainable Development Goals). In Japan, the Industrial Safety and Health Act will be revised in April 2024, strengthening the handling of chemical substances. To reduce health risks for workers and environmental burdens, some companies are moving to avoid procuring materials that have a significant environmental impact, and cleaning agents are no exception. Taking into account initiatives overseas, we will introduce regulations related to cleaning agents. *For detailed information, please refer to the related links. For further inquiries, feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Examples of the analysis of the cleaning properties of surfactants are also included! We will also introduce ions and flux.

This document explains the analysis of ionic residues on electronic substrates that our company, as a cleaning agent manufacturer, has been working on. It includes explanations about ions and flux, as well as discussions on ion contamination measurement, ion chromatography, and scanning electron microscopy with energy dispersive X-ray spectroscopy. Additionally, it features case studies on the cleaning efficacy of surfactants. We encourage you to download it and read through it. 【Contents】 ■ Introduction ■ What are ionic residues? ■ Analysis of ionic residues remaining on electronic substrates ■ Case study - Cleaning efficacy of surfactants - ■ Conclusion *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Printed Circuit Board
Substrate Cleaning Agent

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Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Trends in flux cleaning due to miniaturization! Introducing technical points in fine bonding products.

Electronics assembly refers to the technology of mounting electronic components onto a substrate. Specifically, it involves the process of joining components such as semiconductors, resistors, and capacitors to a printed circuit board to form an electrical circuit. The sizes of these components tend to become smaller in response to the demands for higher performance and space-saving in products, and accordingly, fine joining technologies are also evolving. This has a significant impact on the cleaning processes as well. We will explain the evolution of joining technologies and cleaning in fine joining. *For detailed content of the article, you can view it through the related links. For more information, please download the PDF or feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

Printed Circuit Board
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Cleaning technology required for sintered joint devices [Technical Document]

Introduction to the specific sintering cleaning process! Discussion of the differences from flux cleaning, etc.

This document explains the cleaning techniques required for sintered joining devices. It discusses the background for the need for cleaning in sintered joining devices and the differences from flux cleaning, as well as introducing specific cleaning processes. It also includes information on the selection of cleaning agents and methods, as well as cleanliness analysis after cleaning. We encourage you to read it. 【Contents】 ■ Introduction ■ The formation of contamination and the effects of residues in sintered joining devices ■ Selection of cleaning agents and methods ■ Cleanliness analysis after cleaning ■ Cleaning case studies ■ Conclusion *For more details, please download the PDF or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Zestron Japan Co., Ltd. Product Catalog

For cleaning flux on printed circuit boards! A variety of water-based and solvent-based cleaners are available.

This catalog introduces the product lineup of Zestron Japan Co., Ltd. It includes examples of products suitable for situations such as "printed circuit board cleaning" and "package and wafer cleaning," as well as applications and features. We also provide explanations of each product's technology and brand, along with the lineup. Please make use of this information when selecting products. [Contents (partial)] ■ Cleaning process introduction flow ■ Printed circuit board cleaning ■ Flux removal for power electronics ■ Package and wafer cleaning ■ Cleaning of metal masks, screens, and misprinted circuit boards *For more details, please refer to the PDF document or feel free to contact us.

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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What is flux residue? Diversification and analysis methods of flux residue.

Cleaning methods and post-cleaning analysis are recent challenges! We will introduce examples of issues caused by flux residues.

Flux residue refers to the residue derived from flux that remains on the workpiece after soldering (contamination), and its components include ions, metal salts, and organic substances. Cleaning paste is formulated with the premise of cleaning, so if left as is, the likelihood of insulation failure due to migration and corrosion increases. Depending on the application, this can also affect human life and infrastructure, making cleaning necessary in some cases. On the other hand, in the case of no-clean paste, the flux residue stabilizes, but the number of cases requiring cleaning for reliability assurance is also increasing. *For detailed content of the column, please refer to the related link. For more information, feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Examples of technical challenges related to 5G

Behind the scenes of 5G development by the responsible company! Introducing cleaning know-how.

"5G," which has gained even more attention due to the new coronavirus. In Japan, commercial services started in the spring of 2020, and it is said to have an impact not only on mobile phones but also in various fields such as automobiles, industrial equipment, and healthcare. Since it is a technology that has evolved further from 4G, it is easy to imagine that there were many challenges in its development. Curious about the background, I spoke with companies involved in the development of 5G. *For more details, you can view the related links. Please refer to the PDF materials or feel free to contact us for more information.*

Company：ゼストロンジャパン
Price：Other

Technical and Reference Books
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Examples of technical challenges related to 5G [Joint Research]

We will introduce an example of how to actually solve the technical challenges associated with 5G!

On this page, we will discuss how to solve the technical challenges associated with 5G, providing an example of a solution. In the previous discussion, we learned that there are cases in 5G-related work where failure can occur if cleaning is not performed. Now, regarding "how to clean," there are important points to consider in the case of 5G work. *For detailed information, please refer to the related links. For more information, please check the PDF materials or feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

Technical and Reference Books
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Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

By selecting cleaning solder paste and flux, you can ensure more reliable cleanliness!

The theme of this discussion is ions, which are essential for electronic devices. However, unintended ions can remain on the device surface, between electrodes, or in low stand-off areas, resulting in "ion residue." Moreover, since these residues can be supplied from various contamination pathways that include not only raw material factors but also environmental factors, achieving a residual amount of zero is technically very challenging. In this instance, we have collaborated with solder manufacturers to assess the ion residue levels for each implemented component. *For more detailed information, please refer to the related links. *The PDF document is a technical resource that explains the issues and analysis methods related to ion residue.

Company：ゼストロンジャパン
Price：Other

Technical and Reference Books
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Effects of morphological changes in flux residues after soldering on cleanability.

[Joint Research] Joint research on the effects of morphological changes on washability! Detailed explanations and images are presented.

The no-clean solder paste, which continues to evolve, generates significant heat in fields such as 5G devices and high-power devices for electric vehicles (EVs). As environmental burdens increase, it is necessary to pay attention to long-term changes even in stabilized flux residues. Recent market trends have led to the miniaturization of high-performance electronic devices, resulting in reduced distances between components. This, along with the demand for high-speed calculations and increased capacity, has resulted in high currents and voltages. Consequently, even slight flux residues that were previously not problematic can pose various risks, making cleaning necessary in high-reliability devices, even for no-clean flux residues. Together with Mr. Hiroki, who is developing high-performance solder paste, we conducted joint research on the morphological changes of flux residues after soldering and their impact on cleanability. *For more details, please refer to the related links. *The PDF document is a technical material explaining the evolution and challenges of power devices.

Company：ゼストロンジャパン
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Technical and Reference Books
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Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Published solutions to challenges in the formation of metal salts (Bi salts)! We conducted joint verification of cleaning performance.

The Sn-Bi solder paste has various advantages, but in high-reliability fields, there are situations where cleaning is required, and one of the cleaning challenges is the formation of metal salts (Bi salts) after sintering. Bi salts can potentially cause migration issues, are difficult to dissolve in organic solvents, and make cleaning challenging. To address the issue of Bi salt formation, we conducted a joint verification of the cleaning properties of the low-melting-point Sn-Bi solder paste developed by Japan Superior Inc. *For more details, please refer to the related link. *The PDF document is a technical material that explains the evolution and challenges of power devices.

Company：ゼストロンジャパン
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Technical and Reference Books
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Is a cleaning agent really unnecessary? Cleaning verification of water-soluble flux / Joint research with Hiroki.

Is a cleaning agent really unnecessary? Information on the cleaning verification results of water-soluble flux.

In current electronics assembly in Japan, rosin-based flux is predominantly used for soldering. However, due to the promotion of the SDGs and the increasing interest in reducing environmental impact, there is an active evaluation of water-soluble flux, which is expected to reduce VOC emissions and cleaning burdens. This time, we will present an investigation into the actual cleaning situation of water-soluble flux, which is recognized as easier to clean than rosin-based flux. *For detailed information, please refer to the related links. For more details, you can download the PDF or feel free to contact us.*

Company：ゼストロンジャパン
Price：Other

Cleaning agents
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Causes and Countermeasures of Ion Migration: Preventing Invisible Defects on the Substrate

What is ion migration? An explanation of invisible defects that threaten the reliability of electronic devices.

Modern electronic devices are highly advanced, and even minor malfunctions can lead to significant incidents. Events that undermine insulation threaten the reliability of products, and one phenomenon that can contribute to this is ion migration, which has been considered a past issue. It has been said that this has been overcome due to the evolution of various insulating materials such as coatings and resists, as well as the advancement of no-clean technologies. However, as the miniaturization and high density of electronic substrates progress rapidly, ensuring insulation has become increasingly difficult, and the risk of ion migration is once again rising. This article will explain why ion migration has become a trend again, exploring its mechanisms, specific countermeasures, and evaluation methods to assess the potential for occurrence. *For more detailed information, please refer to the related links. For further inquiries, feel free to download the PDF or contact us.*

Company：ゼストロンジャパン
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others
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The impact of cleaning and rinsing conditions on insulation reliability.

Introduction to the comparative evaluation of water-soluble flux and rosin-based flux!

This joint research was conducted as part of ongoing verification based on the research results with Mr. Hiroki in 2025. In this study, we focused on whether similar trends are observed with rosin-based fluxes, evaluating the impact of differences in cleaning and rinsing conditions on insulation reliability and surface condition. Furthermore, we also examined the differences in post-cleaning characteristics based on the type of flux through comparisons with water-soluble fluxes. *For detailed content of the article, please refer to the related link. For more information, please download the PDF or feel free to contact us.*

Company：ゼストロンジャパン
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Solder
Substrate Cleaning Agent

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Substrate Cleaning Agent - List of Manufacturers, Suppliers, Companies and Products | IPROS GMS

Substrate Cleaning Agent Product List

Metal mask printing error substrate cleaning agent VIGON SC 202

Exploring the Current State of Solder Cleaning - The Evolution of Solder and Cleaning - [Technical Document Download]

Review of Cleaning Mechanisms - Limitations of Existing Cleaning Methods - [Technical Document]

What is substrate cleaning? An explanation from basic knowledge to the latest trends in cleaning challenges.

Why is cleaning necessary for sintering bonding? [Cleaning issues in sintering bonding]

Verification of cleaning properties of solder paste for fine bonding in joint research with Nippon Superior Co., Ltd.

Zero defects and half the cleaning time [Improvement case]

Compliance with regulations and safety measures for cleaning agents! A step-by-step explanation of purchasing, using, and storing.

Ion Residues on Electronic Substrates and Their Analytical Methods [Free Download]

Three Key Points of Technological Evolution in Electronics Implementation and Cleaning

Cleaning technology required for sintered joint devices [Technical Document]

Zestron Japan Co., Ltd. Product Catalog

What is flux residue? Diversification and analysis methods of flux residue.

Examples of technical challenges related to 5G

Examples of technical challenges related to 5G [Joint Research]

Relationship between implementation components and ion residues [Joint research with Mr. Hiroki]

Effects of morphological changes in flux residues after soldering on cleanability.

Verification of the cleaning properties of Sn-Bi low melting point solder paste - Joint Research

Is a cleaning agent really unnecessary? Cleaning verification of water-soluble flux / Joint research with Hiroki.

Causes and Countermeasures of Ion Migration: Preventing Invisible Defects on the Substrate

The impact of cleaning and rinsing conditions on insulation reliability.

Related Categories of Substrate Cleaning Agent